FEATURE : 5G
However , the report says 6G will face greater challenges compared to 5G mmWave in both technology development and market penetration , given its even higher frequencies .
Overcoming these hurdles will , the report says , necessitate the development of innovative technological solutions , including advancements in packaging technologies for antennas to minimize signal transmission issues .
Additionally , the report identifies a crucial need for stronger market identification of future applications to drive the adoption of 6G technologies . This entails not only identifying killer applications but also fostering the ecosystem necessary for their successful implementation .
Along with a 10-year granular market forecast of 5G infrastructure , key aspects of the report include :
Overview of 5G mmWave development and 6G roadmap :
• Explores the status of 5G mmWave development , technology innovation roadmap , key applications and market outlook .
• Understand the landscape of 6G , including potential spectrum , enabling THz communication technologies , key research and industry activities , roadmap , technical targets and applications .
Deep dive into beamforming technologies enabled by phased array antenna for 5G mmWave :
• Compares beamforming technologies of 5G sub-6 vs mmWave .
• Examines phased array technologies , including antenna , semiconductor , and packaging integration components , technical requirements , trends , and design considerations .
Antenna integration technologies for 5G mmWave :
• Discusses antenna substrate technology , benchmarking , material requirements , and packaging for phased arrays .
• Explores various antenna packaging technologies for 5G mmWave , including antenna on PCB and antenna in package ( AiP ), categorized by packaging technologies : Flip-chip vs fan-out . Also , discuss substrate material choices , such as LTCC , low-loss organic-based , and glass , covering production challenges , material choices and benchmarks , solutions / case studies from key players , and substrate design considerations for each packaging technology .
Antenna integration technologies for applications beyond 100 GHz :
• Addresses challenges in 6G transceiver development , focusing on power requirements , antenna gain , and phased array demands .
• Discusses various potential packaging technologies for beyond 100 GHz applications , covering thermal management options and lowloss material choices for antenna substrates . Include case studies showcasing D-band ( 110 – 170 GHz ) phased array technology . p
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